Electric Wafer Bisuits Making Machine

  • Output:206 kg/h
  • Power:About 100 kw
  • Voltage: 380 v
  • Size: Can be customized
  • Weight: Wafer biscuits machine line

Features

Description for Electric Wafer Biscuits Making Machine
The production line is designed based on the advanced structure of similar products at home and abroad, adopts electric heating method as the heat source, exclusive research and development, successfully solve the problem of the high cost, color different during the wafer production.
Electric Wafer Making Machine
Technological process for wafer biscuits production:
Wafer batter mixing -- Cream mixing -- Baking into wafer sheet -- Cooling  -- Wafer sheet picking -- Cream spreading -- Cooling the wafer sheet after spreading cream - Cutting wafer sheet into certain size.
Wafer Biscuits Manufacturing Process
Equipment for Wafer Biscuits Making Machine
This production line includes wafer batter mixer, smashing machine, cream mixer, tunnel baking oven, sheet receiver, cooling machine, sheet picking machine, cream spreading machine, cooling cabinet, cutting machine, etc.

Following is the introduction of each machine:
Wafer batter mixing  machine: The equipment uses the pulp system, the first wafer processing equipment of the production line. Adopt the separate transmission and automatic circulation system.
Cream mixer machine: This equipment, through the slow speed, mix sugar powder, essence, cocoa butter, wafer edge broken material, maltose, etc material, and then by quickly mix adequately butter or peanut butter, chocolate sauce, sesame paste, etc.
Tunnel baking oven: The device uses electricity heating or PLC to heat and bake wafer sheet. Use Siemens PLC program, touch screen control, convenient operation, automatic temperature control, firing, batter feeding, blowing, sheet receiving process.
Cooling machine: The device is through natural cooling to mitigate thermal stress effect of wafer bread slices, soft cooling, make the wafer bread slices not easy to broken, taste good.
Cream spreading machine: Automatically spreading cream, peanut pulp evenly on the wafer bread slices, lay in multilayer double color, double sandwich wafer. Thickness of cream and the wafer cake layer can be adjustable.
Wafer cutting machine: This machine can use the blade or steel wire cutting, are used to cut wafer cake piece, cut size can be adjustable, automatically cut through vertical and horizontal two kinds of cutting.
Wafer biscuit smashing machine: This machine is used to crush broken wafers in the process of production, grinding the leftover material through high speed blade, the crushed powder can be used to make butter, reducing wear and tear.

Related Product:
27 Mould Wafer Biscuit Line

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